TE Connectivity 2.54mm Pitch Vertical 8 Way, Through Hole Turned Pin Open Frame IC Dip Socket, 3A
- RS-stocknr.:
- 718-5155
- Fabrikantnummer:
- 808-AG10D
- Fabrikant:
- TE Connectivity
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- RS-stocknr.:
- 718-5155
- Fabrikantnummer:
- 808-AG10D
- Fabrikant:
- TE Connectivity
Specificaties
Datasheets
Wetgeving en conformiteit
Productomschrijving
Zoek vergelijkbare producten door een of meer kenmerken te selecteren.
Alles selecteren | Attribuut | Waarde |
|---|---|---|
| Merk | TE Connectivity | |
| Number of Contacts | 8 | |
| Mounting Type | Through Hole | |
| Pin Type | Turned | |
| Pitch | 2.54mm | |
| Row Width | 7.62mm | |
| Frame Type | Open Frame | |
| Termination Method | Solder | |
| Contact Plating | Gold | |
| Current Rating | 3A | |
| Orientation | Vertical | |
| Length | 10.16mm | |
| Width | 10.16mm | |
| Depth | 2.67mm | |
| Dimensions | 10.16 x 10.16 x 2.67mm | |
| Housing Material | PET | |
| Contact Material | Beryllium Copper | |
| Maximum Operating Temperature | +105°C | |
| Minimum Operating Temperature | -55°C | |
| Alles selecteren | ||
|---|---|---|
Merk TE Connectivity | ||
Number of Contacts 8 | ||
Mounting Type Through Hole | ||
Pin Type Turned | ||
Pitch 2.54mm | ||
Row Width 7.62mm | ||
Frame Type Open Frame | ||
Termination Method Solder | ||
Contact Plating Gold | ||
Current Rating 3A | ||
Orientation Vertical | ||
Length 10.16mm | ||
Width 10.16mm | ||
Depth 2.67mm | ||
Dimensions 10.16 x 10.16 x 2.67mm | ||
Housing Material PET | ||
Contact Material Beryllium Copper | ||
Maximum Operating Temperature +105°C | ||
Minimum Operating Temperature -55°C | ||
Standard, Gold Plated - TE Connectivity
These sockets have precision four-fingered inner contacts for high reliability.
Precision four-finger inner contact provides concentric funnel entry for easy flat and round lead insertion
"X" and "Y" Stackable
Low profile
Accommodates rectangular or round IC leads
Non-wicking, closed bottom sleeve gives 100% protection against flux and solder contamination
Recognized under the Component Program of Underwriters Laboratories, Inc. file No. E111362
Beryllium copper inner contact for maximum mechanical and electrical performance
"X" and "Y" Stackable
Low profile
Accommodates rectangular or round IC leads
Non-wicking, closed bottom sleeve gives 100% protection against flux and solder contamination
Recognized under the Component Program of Underwriters Laboratories, Inc. file No. E111362
Beryllium copper inner contact for maximum mechanical and electrical performance