E-TEC, POS/POO/PCL 2.54 mm Pitch Vertical 8 Way, Through Hole Turned Pin Open Frame DIL Socket
- RS-stocknr.:
- 615-5263
- Fabrikantnummer:
- POS-308-S003-55
- Fabrikant:
- E-TEC
Afbeelding representeert productcategorie
Subtotaal (1 verpakking van 10 eenheden)*
€ 51,58
(excl. BTW)
€ 62,41
(incl. BTW)
GRATIS bezorging voor bestellingen vanaf € 75,00
Op voorraad
- 190 stuk(s) klaar voor verzending vanaf een andere locatie
Heeft u meer nodig? Klik op 'Controleer leverdata' voor extra voorraad en levertijden.
Aantal stuks | Per stuk | Per verpakking* |
|---|---|---|
| 10 + | € 5,158 | € 51,58 |
*prijsindicatie
- RS-stocknr.:
- 615-5263
- Fabrikantnummer:
- POS-308-S003-55
- Fabrikant:
- E-TEC
Specificaties
Datasheets
Wetgeving en conformiteit
Productomschrijving
Zoek vergelijkbare producten door een of meer kenmerken te selecteren.
Alles selecteren | Attribuut | Waarde |
|---|---|---|
| Merk | E-TEC | |
| Number of Contacts | 8 | |
| Product Type | DIL Socket | |
| Mount Type | Through Hole | |
| Pin Type | Turned | |
| Pitch | 2.54mm | |
| Row Width | 7.62mm | |
| Frame Type | Open Frame | |
| Contact Plating | Gold | |
| Orientation | Vertical | |
| Termination Type | Wire Wrap | |
| Standards/Approvals | No | |
| Width | 4.9 mm | |
| Length | 10.1mm | |
| Housing Material | Polybutylene Terephthalate | |
| Series | POS/POO/PCL | |
| Contact Material | Beryllium Copper Alloy | |
| Alles selecteren | ||
|---|---|---|
Merk E-TEC | ||
Number of Contacts 8 | ||
Product Type DIL Socket | ||
Mount Type Through Hole | ||
Pin Type Turned | ||
Pitch 2.54mm | ||
Row Width 7.62mm | ||
Frame Type Open Frame | ||
Contact Plating Gold | ||
Orientation Vertical | ||
Termination Type Wire Wrap | ||
Standards/Approvals No | ||
Width 4.9 mm | ||
Length 10.1mm | ||
Housing Material Polybutylene Terephthalate | ||
Series POS/POO/PCL | ||
Contact Material Beryllium Copper Alloy | ||
Wrapping DIL sockets with gold leads
DIL format sockets with wire wrap contacts for integrated circuits.
The contacts on these sockets are fully gold-plated to improve wrapping lead conductivity.
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