TE Connectivity, 824-AG11D 2.54mm Pitch Vertical 24 Way, Board Mount Standard Pin Ladder IC Dip Socket, 3A

The TE Connectivity Advanced DIP socket designed to provide secure and reliable connectivity for integrated circuits on printed circuit boards. This component features a robust construction with a standard profile, ensuring optimal performance in various electronic applications. Its vertical PCB mount orientation facilitates space-efficient designs, while the precise row-to-row spacing guarantees compatibility with standard IC configurations. Crafted from high-quality materials, including tin and gold plating, this DIP socket enhances contact reliability, making it ideal for demanding signal applications. With its innovative design and thoughtfully engineered features, the product ensures long-lasting operation and support for efficient circuit integration, making it an essential component for engineers and designers alike.

Standard profile allows for easy integration into existing PCB layouts
Vertical orientation optimises space and improves overall design efficiency
Stamped & formed contact fabrication ensures superior durability
Mating alignment with polarization aids in straightforward installation
Packaged in quantities of 20 for convenient stock management
UL Flammability Rating provides reassurance regarding safety standards
Wave solder capable to 265°C accommodates various manufacturing processes
Black thermoplastic polyester housing offers a professional aesthetic
Includes features for high current rating, supporting up to 3 A
Meets compliance standards for EU RoHS, ensuring environmentally responsible manufacturing