Specificaties

Datasheets

Wetgeving en conformiteit

Productomschrijving

Zoek vergelijkbare producten door een of meer kenmerken te selecteren.

Alles selecteren	Attribuut	Waarde
	Merk	Infineon
	Number of Elements per Chip	1
	Maximum Supply Current	32 mA
	Maximum Input Frequency	133MHz
	Mounting Type	Surface Mount
	Package Type	TSSOP
	Pin Count	16
	Dimensions	5.1 x 4.5 x 0.95mm
	Length	5.1mm
	Width	4.5mm
	Height	0.95mm
	Maximum Operating Supply Voltage	3.6 V
	Maximum Operating Temperature	+70 °C
	Maximum Output Frequency	133.3MHz
	Minimum Operating Supply Voltage	3 V
	Minimum Operating Temperature	0 °C
	Minimum Output Frequency	10MHz

	Alles selecteren
	Merk Infineon
	Number of Elements per Chip 1
	Maximum Supply Current 32 mA
	Maximum Input Frequency 133MHz
	Mounting Type Surface Mount
	Package Type TSSOP
	Pin Count 16
	Dimensions 5.1 x 4.5 x 0.95mm
	Length 5.1mm
	Width 4.5mm
	Height 0.95mm
	Maximum Operating Supply Voltage 3.6 V
	Maximum Operating Temperature +70 °C
	Maximum Output Frequency 133.3MHz
	Minimum Operating Supply Voltage 3 V
	Minimum Operating Temperature 0 °C
	Minimum Output Frequency 10MHz

Datasheet CY2309NZSXC-1H

The CY2309NZ is a low-cost buffer designed to distribute high-speed clocks in mobile PC systems and desktop PC systems with SDRAM support. The part has nine outputs, eight of which can be used to drive two DIMMs or four SO-DIMMs, and the remaining can be used for external feedback to a PLL. The device operates at 3.3 V and outputs can run up to 133.33 MHz. The CY2309NZ is designed for low EMI and power optimization. It has multiple VSS and VDD pins for noise optimization and consumes less than 32 mA at 66.6 MHz, making it ideal for the low-power requirements of mobile systems. It is available in an ultra-compact 150-mil 16-pin SOIC package.

Infineon CY2309NZSXC-1H PLL Clock Buffer 16-Pin TSSOP