100 Ω STMicroelectronics Surface Chip Balun
- RS-stocknr.:
- 192-4968P
- Fabrikantnummer:
- BAL-UWB-01E3
- Fabrikant:
- STMicroelectronics
Bulkkorting beschikbaar
Bekijk bulkkortingSubtotaal 100 eenheden (geleverd op een doorlopende strip)*
€ 37,60
(excl. BTW)
€ 45,50
(incl. BTW)
GRATIS bezorging voor bestellingen vanaf € 90,00
Tijdelijk niet op voorraad
- Verzending vanaf 15 december 2026
Heeft u meer nodig? Klik op 'Controleer leverdata' voor extra voorraad en levertijden.
Aantal stuks | Per stuk |
|---|---|
| 100 - 225 | € 0,376 |
| 250 - 475 | € 0,362 |
| 500 - 975 | € 0,351 |
| 1000 + | € 0,337 |
*prijsindicatie
- RS-stocknr.:
- 192-4968P
- Fabrikantnummer:
- BAL-UWB-01E3
- Fabrikant:
- STMicroelectronics
Specificaties
Datasheets
Wetgeving en conformiteit
Productomschrijving
Zoek vergelijkbare producten door een of meer kenmerken te selecteren.
Alles selecteren | Attribuut | Waarde |
|---|---|---|
| Merk | STMicroelectronics | |
| Product Type | Chip Balun | |
| Balance Impedance | 100Ω | |
| Maximum Insertion Loss | 1.2dB | |
| Mount Type | Surface | |
| Pin Count | 6 | |
| Maximum Frequency | 8GHz | |
| Minimum Frequency | 3GHz | |
| Minimum Operating Temperature | -40°C | |
| Package Type | Bumpless CSP | |
| Maximum Operating Temperature | 105°C | |
| Length | 1.825mm | |
| Standards/Approvals | No | |
| Alles selecteren | ||
|---|---|---|
Merk STMicroelectronics | ||
Product Type Chip Balun | ||
Balance Impedance 100Ω | ||
Maximum Insertion Loss 1.2dB | ||
Mount Type Surface | ||
Pin Count 6 | ||
Maximum Frequency 8GHz | ||
Minimum Frequency 3GHz | ||
Minimum Operating Temperature -40°C | ||
Package Type Bumpless CSP | ||
Maximum Operating Temperature 105°C | ||
Length 1.825mm | ||
Standards/Approvals No | ||
- Land van herkomst:
- CN
The BAL-UWB-01E3 is an ultra-miniature balun that integrates matching network, dedicated to ultra-wide band 3 GHz to 8 Ghz. This device uses STMicroelectronics IPD technology on non conductive glass substrate which optimizes RF performance.
Very low profile
High RF performance
PCB space saving
Efficient manufacturability
LGA footprint compatible
Low thickness ≤ 450 μm
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