Infineon TLE72593GEXUMA3, LIN Transceiver 20 kbps, 8-Pin DSO

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Verpakkingsopties
RS-stocknr.:
110-7492
Fabrikantnummer:
TLE72593GEXUMA3
Fabrikant:
Infineon
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Merk

Infineon

Maximum Data Rate

20kbps

Product Type

LIN Transceiver

Number of Transceivers

1

Sub Type

LIN Transceiver

Power Down Mode

Standby

Supply Current

5mA

Mount Type

Surface

Interface Type

IEC 61000-4-2, ISO 17987-4

Package Type

DSO

Pin Count

8

Minimum Supply Voltage

-0.3V

Maximum Supply Voltage

40V

ESD Protection

Yes

Minimum Operating Temperature

-40°C

Maximum Operating Temperature

150°C

Height

1.45mm

Length

5mm

Standards/Approvals

No

Series

TLE7259-3GE

Automotive Standard

AEC-Q100

Infineon TLE7259-3GE Series LIN Transceiver, 20kbps Maximum Data Rate, 40V Maximum Supply Voltage - TLE72593GEXUMA3


This LIN transceiver provides single-channel communication for low-speed vehicle networks and similar control systems. Designed for integration on surface-mounted circuits, it interfaces with LIN bus environments and offers protection against electrostatic events while operating across a wide temperature range suitable for demanding conditions.

Features and Benefits:


• Supports data transfer up to 20 kbps for timely message exchange
• Withstands supply voltages to 40V for robust electrical margins
• Operates down to -0.3V supply threshold to handle transient conditions
• Draws 5 mA supply current to reduce power consumption in standby use
• Meets automotive grade AEC‑Q100 for in-vehicle qualification
• Provides IEC 61000-4-2 compliant ESD protection to safeguard interfaces

Applications


• Suitable for body control modules in passenger vehicles
• Ideal for gateway nodes linking subsystems on LIN bus
• Used with sensor clusters requiring low-speed serial links
• Can be used for actuation control in lighting systems
• Used for diagnostic interfaces in automotive maintenance tools

How many channels does it provide for LIN network design?


It implements a single transceiver channel suitable for point-to-point LIN links.

Which package format is available for board assembly?


It is supplied in a DSO package intended for surface-mount placement.

What pin count should designers allocate on their board?


The device requires an 8‑pin footprint for correct connectivity.

What thermal range can the component tolerate during operation?


It is rated to function from -40 °C up to 150 °C for extended temperature resilience.

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