Molex 1.9mm Pitch Connector Backplane Connector, HDR, Vertical, 12 Column, 12 Row, 144 Way, 170335
- RS-stocknr.:
- 684-011
- Fabrikantnummer:
- 170335-1227
- Fabrikant:
- Molex
Subtotaal (1 tray van 8 eenheden)*
€ 192,38
(excl. BTW)
€ 232,78
(incl. BTW)
GRATIS bezorging voor bestellingen vanaf € 75,00
Tijdelijk niet op voorraad
- Verzending vanaf 29 mei 2026
Heeft u meer nodig? Klik op 'Controleer leverdata' voor extra voorraad en levertijden.
Tray(s) | Per tray | Per stuk* |
|---|---|---|
| 1 + | € 192,38 | € 24,048 |
*prijsindicatie
- RS-stocknr.:
- 684-011
- Fabrikantnummer:
- 170335-1227
- Fabrikant:
- Molex
Specificaties
Datasheets
Wetgeving en conformiteit
Productomschrijving
Zoek vergelijkbare producten door een of meer kenmerken te selecteren.
Alles selecteren | Attribuut | Waarde |
|---|---|---|
| Merk | Molex | |
| Backplane Connector Type | Connector | |
| Gender | HDR | |
| Number of Contacts | 144 | |
| Number of Columns | 12 | |
| Number of Rows | 12 | |
| Body Orientation | Vertical | |
| Pitch | 1.9mm | |
| Series Number | 170335 | |
| Alles selecteren | ||
|---|---|---|
Merk Molex | ||
Backplane Connector Type Connector | ||
Gender HDR | ||
Number of Contacts 144 | ||
Number of Columns 12 | ||
Number of Rows 12 | ||
Body Orientation Vertical | ||
Pitch 1.9mm | ||
Series Number 170335 | ||
- Land van herkomst:
- SG
The Molex Impact 85 Ohm Plus 4 Pair Vertical Header designed to provide reliable connectivity in high-performance applications. With its dual end wall structure and 12 columns featuring 144 circuits, this PCB header excels in delivering precision connections in mezzanine and conventional applications. Enhanced durability is ensured with a mating cycle maximum of 200, allowing consistent performance in critical environments. This lead-free component operates within a temperature range of -55° to +85°C, making it suitable for a variety of industrial settings. Ideal for use in advanced electronics, it adheres to stringent environmental compliance standards, highlighting both its functionality and eco-friendliness.
Dual end wall design enhances stability and connectivity
Lead free materials contribute to environmental compliance
Finished with gold plating for optimal electrical conductivity
High temperature thermoplastic resin improves thermal resistance
Designed for through hole compliant pin termination for robustness
Suitable for high speed applications with a data rate of 25 Gbps
Lead free materials contribute to environmental compliance
Finished with gold plating for optimal electrical conductivity
High temperature thermoplastic resin improves thermal resistance
Designed for through hole compliant pin termination for robustness
Suitable for high speed applications with a data rate of 25 Gbps
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