Molex, 171575 2.15 mm Pitch Connector Backplane Connector, Right Angle, 10 Column, 15 Row, 150 Way
- RS-stocknr.:
- 683-569
- Fabrikantnummer:
- 171575-7108
- Fabrikant:
- Molex
Subtotaal (1 tray van 3 eenheden)*
€ 211,14
(excl. BTW)
€ 255,48
(incl. BTW)
GRATIS bezorging voor bestellingen vanaf € 90,00
Tijdelijk niet op voorraad
- Verzending vanaf 21 september 2026
Heeft u meer nodig? Klik op 'Controleer leverdata' voor extra voorraad en levertijden.
Tray(s) | Per tray | Per stuk* |
|---|---|---|
| 1 + | € 211,14 | € 70,38 |
*prijsindicatie
- RS-stocknr.:
- 683-569
- Fabrikantnummer:
- 171575-7108
- Fabrikant:
- Molex
Specificaties
Datasheets
Wetgeving en conformiteit
Productomschrijving
Zoek vergelijkbare producten door een of meer kenmerken te selecteren.
Alles selecteren | Attribuut | Waarde |
|---|---|---|
| Merk | Molex | |
| Product Type | Backplane Connector | |
| Backplane Connector Type | Connector | |
| Current | 750mA | |
| Number of Contacts | 150 | |
| Orientation | Right Angle | |
| Number of Columns | 10 | |
| Number of Rows | 15 | |
| Voltage | 30V | |
| Pitch | 2.15mm | |
| Contact Plating | Gold over Tin | |
| Minimum Operating Temperature | -55°C | |
| Termination Type | Solder | |
| Maximum Operating Temperature | 85°C | |
| Standards/Approvals | REACH, RoHS | |
| Series | 171575 | |
| Alles selecteren | ||
|---|---|---|
Merk Molex | ||
Product Type Backplane Connector | ||
Backplane Connector Type Connector | ||
Current 750mA | ||
Number of Contacts 150 | ||
Orientation Right Angle | ||
Number of Columns 10 | ||
Number of Rows 15 | ||
Voltage 30V | ||
Pitch 2.15mm | ||
Contact Plating Gold over Tin | ||
Minimum Operating Temperature -55°C | ||
Termination Type Solder | ||
Maximum Operating Temperature 85°C | ||
Standards/Approvals REACH, RoHS | ||
Series 171575 | ||
- Land van herkomst:
- SG
The Molex Impact 100 Ohm 5 Pair Right-Angle Orthogonal Direct Header is engineered for optimal connectivity in high-performance applications. Featuring a robust design with a right-angle orientation, this component excels in space-constrained environments, providing efficient alignment for PCB integration. Its durable construction, incorporating high-performance alloy and high-temperature thermoplastic materials, ensures exceptional longevity, while the gold and tin plating enhances reliability and signal integrity. With a data rate capability of 25 Gbps and an impedance of 100 ohm, this header is ideally suited for sophisticated backplane connections, making it a valuable asset for cutting-edge electronic systems.
Designed for seamless integration in space restricted applications
Robust construction ensures reliable performance under demanding conditions
Lead free materials contribute to environmental compliance
Compatible with 1mm PCB thickness for consistent installation
Flammability rating of 94V0 for enhanced safety standards
Durability of up to 200 mating cycles for long lasting use
Allows for easy orientation and mating part alignment
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