Intelligent LED Solutions Thermal Gap Pad, 1.6mm Thick, Metal, 20 x 20 x 1.6mm

Designed specifically for LED applications, this range of Insulated Metal Substrates (IMS) also known as Metal Clad Printed Circuit Boards, are designed to allow better thermal management also allowing for more forward current to LEDs. Whilst being able to maintain die temperatures, this results in more light with the potential to use less LEDs for the end application.

Designed from the standard hex star board footprint, boards have a range or Heat Sinks and Thermal Interface Materials for easy, plug and play operations.

Cree: XHP35, XP-C, XP-E, XP-E2, XP-G, XP-G2, XP-G3, XP-L, XP-L2, XT-E
Nichia: NVSL119C, NVSW119C, NVSW219C, NVSL219C, NVSW119B-V1, NVSL119B-V1, NVSW219B-V1, NVSL219B-V1, NCSW119B-V1, NCSL119B-V1 and NCSW219B-V1
LumiLED: Luxeon Q Seoul: Z5, Z5P, Z5M
Samsung: LH351D and LH351B LG: H35C4, H35F0, H35A0, H35B0 and H35C0 TSLC: N3535, C3535