- RS-stocknr.:
- 182-2753
- Fabrikantnummer:
- 74221-101LF
- Fabrikant:
- Amphenol Communications Solutions
tijdelijk niet op voorraad – nieuwe voorraad verwacht op 04/10/2024, met een levertijd van 2 à 3 werkdagen.
Toegevoegd
Prijs Per stuk
€ 32,04
(excl. BTW)
€ 38,77
(incl. BTW)
Aantal stuks | Per stuk |
1 - 9 | € 32,04 |
10 - 24 | € 31,14 |
25 - 49 | € 30,31 |
50 - 99 | € 29,50 |
100 + | € 28,74 |
- RS-stocknr.:
- 182-2753
- Fabrikantnummer:
- 74221-101LF
- Fabrikant:
- Amphenol Communications Solutions
Datasheets
Wetgeving en conformiteit
- Land van herkomst:
- US
Productomschrijving
High density, high speed, discrete contact, array connector
Flexible ground distribution optimizes high speed signal integrity
10Gb/s differential pair performance with under 1% cross-talk
28Gb/s high speed performance documented for 4 mm and 6 mm stack height
Online s-parameter files and signal integrity performance reports improve design accuracy and time-to-market
1.27 mm x 1.27 mm grid provides 71 contacts per cm2 density to save space
Dual-point, long wipe contacts Wide range of sizes and PCB stack heights increase mechanical design flexibility
6 PCB Stack heights: 4 mm to 14mm
8 sizes: 81 to 528 positions Revolutionary, trusted BGA interconnect platform
High density standard BGA attachment lower assembly costs by using standard SMT processes
BGA natural surface tension provides self-alignment and self-leveling for multiple connector usage
Patented BGA contact attachment preserves solder ball positioning
Optimized PCB routing enhances electrical performance ball positioning Quality and Reliability
Time-tested reliability record includes Telcordia GR-1217-CORE and NPS-25298-2 options
Flexible ground distribution optimizes high speed signal integrity
10Gb/s differential pair performance with under 1% cross-talk
28Gb/s high speed performance documented for 4 mm and 6 mm stack height
Online s-parameter files and signal integrity performance reports improve design accuracy and time-to-market
1.27 mm x 1.27 mm grid provides 71 contacts per cm2 density to save space
Dual-point, long wipe contacts Wide range of sizes and PCB stack heights increase mechanical design flexibility
6 PCB Stack heights: 4 mm to 14mm
8 sizes: 81 to 528 positions Revolutionary, trusted BGA interconnect platform
High density standard BGA attachment lower assembly costs by using standard SMT processes
BGA natural surface tension provides self-alignment and self-leveling for multiple connector usage
Patented BGA contact attachment preserves solder ball positioning
Optimized PCB routing enhances electrical performance ball positioning Quality and Reliability
Time-tested reliability record includes Telcordia GR-1217-CORE and NPS-25298-2 options
400 Position BGA Receptacle, 4 mm Component Height, 1.27 mm x 1.27 mm Array, Lead-free
Specificaties
Kenmerk | Waarde |
---|---|
Package Type | SMD |
IC Socket Type | Prototyping Socket |
- RS-stocknr.:
- 182-2753
- Fabrikantnummer:
- 74221-101LF
- Fabrikant:
- Amphenol Communications Solutions